Editorial Reviews:
Product Description
Our New 898D+ model is made using SAMSUNG Micro-Computer Processor and PID technology to enhanced temperature stability and an alloy metal body with high quality silicone shell for extended life and power saving. It's made for commercial uses, such as mounting and reworking SMD components by hand. It's suitable for SOIC, CHIP, QFP, PLCC, BGA, temperature-sensitive components, drying lacquer removal, heating shrink, viscidity removal, ice-out, pre-heating and glue soldering. Comes with 3 nozzles for versatile applications, 10pcs of iron tips, hot air gun, hot iron, de-soldering wick CP-2015F for perfect joint, stand, holder, nozzle spanner, IC extractor and sponge to meet all your needs.
FEATURES: 2 in 1 hot iron and hot air rework soldering station; Efficient, space saving and extremely low noise; Comfortable portable handheld hot air gun and soldering iron; Digital LCD screen; Built-in SAMSUNG microcomputer control, warning-up quickly; PID technology to enhance temperature stability; Rotation control adjusts the airflow and temperature; Rotation stops automatically when temperature is less than 70C; Automatic fire sensor detection alarm; Fault detection cooling system; ESD-protected soldering iron; Alloy metal body with high quality silicone shell for extended life and power saving; Durable, high quality resistance, and lightweight; 3 stainless steel nozzles (0.5mm, 0.7mm, 10mm); 10 extra iron replacement tips (900M-T-B, I, 3C, 2.4D, 1.2D, K, 3.2D, 2C, 1.6D, 4C); De-soldering wick CP-2015F for perfect joint and spanner to conveniently change nozzles; Easy to use IC extractor and a sponge; (Free) plastic holder holds the hot air gun in place; (Free) black stand keeps hot iron in place and away from flammable materials; Suitable for QFP, PLCC, BGA, CHIP SOIC and other temperature-sensitive components; Also for heating shrink, viscidity removal, lacquer removal, preheating, glue soldering and ice-out; Voltage: 110V/AC; CE Approved
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